Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Semiconductor packaging has evolved from traditional 1D PCB designs to cutting-edge 3D hybrid bonding at the wafer level, enabling interconnect pitches in the single-digit micrometer range and ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

Gaps in EDA tool chains for 2.5D designs are limiting the adoption of this advanced packaging approach, which so far has been largely confined to high-performance computing. But as the rest of the ...

The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology. This demand has been ...

The rising demand for AI servers and high-end GPUs has fueled growth in large-size 2.5D interposers, and Hanmi Semiconductor is moving quickly to capture this opportunity. At SEMICON Taiwan 2025, the ...

The rise of co-packaged optics (CPO) is transforming modern data centers and high-performance networks by addressing critical challenges such as bandwidth density, energy efficiency, and scalability.

ANSYS Inc.’s flagship multiphysics analysis solutions are leveraged by Faraday Technology Corporation for the development of advanced designs for modern multi-die 2.5D/3D integrated circuits (ICs).