Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often ...
In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its high-density storage ...
A virtual DOE-based process sensitivity check was performed for two tiers of channel holes in a 3D NAND device. The channel hole tilt distance, twist angle, and their sensitivities to the visible area ...
FREMONT, Calif., July 31, 2024 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today extended its leadership in 3D NAND flash memory etching with the introduction of Lam Cryo™ 3.0, the third ...
Lam Research Introduces World's First Bevel Deposition Solution to Increase Yield in Chip Production
FREMONT, Calif., June 20, 2023 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today introduced Coronus DX, the industry's first bevel deposition solution optimized to address key manufacturing ...
The part 1 of this two-article series outlined the NAND flash technology and how it transitioned from 2D to 3D NAND flash. The article also explained the current challenges in the way of density ...
FREMONT, Calif., July 31, 2024 /PRNewswire/ -- Lam Research Corp. (LRCX) (Nasdaq: LRCX) today extended its leadership in 3D NAND flash memory etching with the introduction of Lam Cryo™ 3.0, the third ...
Over the past three years, we've seen a revolution rippling through NAND manufacturing as companies transition towards stacked NAND configurations that pile dozens of layers of storage directly on top ...
Micron announced its first 3D NAND chip for mobile devices with the goal of cramming more storage into handsets, and maybe reducing reliance on SD card slots. 3D NAND provides more capacity in the ...
To solidify its leading position in the NAND flash market, Samsung Electronics reportedly plans to again utilize a double-stack technology for manufacturing 3D NAND over 300 layers, aiming to surpass ...
The high-aspect-ratio 3D NAND metrology equipment market is no longer a quiet, back-end function inside semiconductor fabs-it is quickly becoming one of the most critical investment areas for memory ...
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