Former CNET editor Dong Ngo has been involved with technology since 2000, starting with testing gadgets and writing code for CNET Labs' benchmarks. He managed CNET's San Francisco Labs, reviews 3D ...
European researchers have made a significant breakthrough in data storage technology by developing a novel 3D metamaterial. This innovative material allows for the storage of entire bit sequences in ...
This year at Flash Memory Summit, several SSD manufacturers announced new products based on 3D NAND. 3D NAND allows flash manufacturers to build larger, more capacious SSDs, with some of the ...
Panasonic is calling on the Blu-ray Disc Association to create an interface standard that will force manufacturers to store 3D images within the left- and right-eye two-channel mode on all HD content.
If you fancy designing and 3D printing your very own network attached storage (NAS) you might be interested in a new project published by makerunit . Who shows how easy it is to create your very own ...
Add Yahoo as a preferred source to see more of our stories on Google. 3D is the memory chip buzzword du jour, because reducing feature sizes is expensive, while stacking memory cells up is much less ...
In an effort to squeeze more storage capacity into flash storage, companies have been developing 3D NAND technology which stacks memory cells on top of one another to increase storage densities. Now ...
Micron announced its first 3D NAND chip for mobile devices with the goal of cramming more storage into handsets, and maybe reducing reliance on SD card slots. 3D NAND provides more capacity in the ...
At last, Intel is making a stand-alone drive based on its extremely fast 3D storage technology... although you're probably not about to pick one up yourself. The chip maker has unveiled the Optane SSD ...
I attended the 7th Annual Non-Volatile Memories Workshop 2016 at UC San Diego this month. Frank T. Hady, Intel Fellow and Chief Architect of 3D XPoint Storage, gave a keynote address to a room full of ...
3D is the memory chip buzzword du jour, because reducing feature sizes is expensive, while stacking memory cells up is much less so. Fabs can use older, stable processes to build larger capacity chips ...