The advanced packaging architecture designed for AI and high-performance computing (HPC) applications involves positioning memory in close proximity to AI processors, such as GPUs and AI ASICs, on a ...
As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between processors and memory. Even ...
Chip designer MediaTek is realigning priorities by diverting its engineering and research muscle toward AI-focused custom ...
The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized" phase shaped by ...
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Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...
TAIPEI (Reuters) -Taiwan's top chip design company, MediaTek, expects to earn revenue of billions of dollars from its AI accelerator ASIC chips by 2027, the chief executive said on Friday, as the ...
Normal Computing has announced its successful tape-out of the world's first thermodynamic computing chip, called CN101. Designed for AI/HPC data centers, the ASIC is a step away from traditional ...
Leading Bitcoin mining ASIC manufacturer Bitmain is set to open its first US-based production facility by early 2026 amid a broader industry shift to the US. The world’s top Bitcoin mining application ...
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