Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach, in its first venture ...

The semiconductor industry is a hallmark of technological innovation, evolving rapidly to meet the demands of an increasingly digital world. At its core, semiconductor manufacturing involves two main ...

Kenmec Mechanical Engineering has entered into an exclusive agency agreement with German humanoid robot startup Neura Robotics to enhance intelligent in-factory logistics, with an initial focus on ...

As the benefits of Moore's law reach their limits, advances in chip performance turn to the back end of production. Back-end semiconductor processing is booming due to limits in front-end innovation.

SEOUL, Jan. 13 (Yonhap) -- SK hynix Inc. said Tuesday it plans to build a new advanced packaging fabrication plant in the central city of Cheongju to establish a full-cycle high-bandwidth memory (HBM) ...