Flip-and-Lap in the fab moves image array to front of imager, which yields sharper, more sensitive pixels, but wafer bonding step adds cost. Tessera Technologies reports a conflict (and resolution) ...
G-ray is a prime example of how science-led companies unlock new opportunities. Having set out to disrupt x-ray medical imaging through the use of germanium absorbers, G-ray struck upon a ...
DENVER – May 31, 2024 – CEA-Leti scientists have reported three projects at ECTC 2024 that they say are steps to enabling CMOS image sensors (CIS) that can exploit image data to perceive a scene, ...
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