SANTA CLARA, Calif. — Intel Corp. has developed a packaging technology that embeds a processor die into a specialized, pc-board-like package, getting rid of solder bumps and much of the interconnect ...
Chipset architecture used to be split into two main chips: the Northbridge for fast stuff like the CPU and RAM, and the ...
This article is part of the TechXchange: Chiplets - Electronic Design Automation Insights. According to Intel, its latest data-center CPU, which packs up to 64 cores spread out over a pair of chiplets ...
It takes too long to get a new compute engine in the field, and everybody complains about it. Customers are impatient because they want more performance and the better bang for the buck that always ...
Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
In the realm of smartphone processors, Arm has historically played second fiddle to Apple‘s iPhone chipsets in terms of single-core CPU power. However, recent reports suggest that Arm is gearing up ...
AUSTIN, TX - February 14, 2005 - AMD (NYSE: AMD) today announced the availability of two AMD Geode™ processor-based development boards designed to help simplify the design and development of x86 ...
Arm has announced three new Armv9-based CPUs: the Arm Cortex-X2, the Cortex-A710, and the Cortex-A510. Arm’s CPU designs are used in the vast majority of Android smartphones today, with everyone from ...
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