Mini LED chips can measure as small as 50μm × 100μm, with pad spacing as narrow as 5-50μm, demanding extreme precision in ...
Tianma's 108" 4K Micro-LED Display features Tianma's all-laser mass transfer process -- from wafer to carrier to glass-based LTPS backplane -- eliminating common PCB substrate issues such as flicker, ...
Recently, a research team led by Academician Lijun Wang at CIOMP under UCAS has systematically reviewed the latest advancements in transfer printing (TP) technology. The team detailed its practical ...
ANSAN, South Korea--(BUSINESS WIRE)--Seoul Viosys (“SVC”) (KOSDAQ: 092190), a globally recognized optical semiconductor element manufacturer, will attend ‘Integrated Systems Europe (ISE) 2023,’ the ...
A new publication from Opto-Electronic Science; DOI 10.29026/oes.2023.230028 discusses the application of lasers in the fabrication of high-efficiency full-color micro-LED displays.
Ottawa-based deep-tech startup Hyperlume is poised to disrupt the landscape of AI and high-performance computing with its innovative optical interconnect solutions. The company is tackling the growing ...
Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...
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