SANTA CLARA, Calif. — New generations of higher density, smaller stacked multichip packages (MCP) are needed to meet the exploding memory needs of servers, switches and routers, and new high speed ...

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

One day we might see on-package DRAM, even. When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. Add us as a preferred source on Google Intel's taken ...