Historically, testability is an afterthought in the design process. But heightening complexity of chip designs, and especially SoCs, forces testability (and manufacturability) to take a more central ...

This is the second part of a two-part discussion (Part 1 appeared in August) in which the author considers fault-coverage analysis and simulation for full-scan testing of ASIC designs. These elements ...

Design for Test (DFT) managers often must make difficult and sometimes costly trade-offs between test implementation effort and manufacturing test cost. The traditional method for evaluating these ...

As semiconductor applications in automotive, data center, and high-performance computing grow increasingly mission-critical, the industry faces mounting pressure to achieve near-perfect manufacturing ...

Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...

The design-for-test (DFT) technology was driven by the need to harness the runaway cost of testing silicon chips on the manufacturing floor. This phenomenon eventually became close to 40% of the cost ...