For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

When properly applied, double-redundant and fail-safe design methods focus validation practices on machine enhancement and reliability, reducing dependence on operator vigilance and intervention. Ray ...

GUANGZHOU, GUANGDONG, CHINA, January 19, 2026 /EINPresswire.com/ -- In the highly competitive global beauty and ...

EU ecodesign measures introduced in early 2026 are tightening sustainability and compliance requirements for packaging producers.

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

Any packing cube is better than none. Lightweight bags and pouches bring order in the chaos of traveling. But for all the good they do in-transit, few cubes offer much utility once you actually arrive ...

View post: Amazon Has a 10-Piece Crowfoot Wrench Set on Sale for Only $16 Packing for a weekend getaway can be both exciting (I start my packing list weeks in advance) and challenging. You want to ...

The Army’s premier training for military packaging has a new home. The Army Sustainment Command Packaging, Storage, and Containerization Center (PSCC), located on-post at Tobyhanna Army Depot, has ...

Packaging science goes far beyond mere protection and containment. It's a bridge between products and consumers, serving as a powerful tool for marketing, sustainability, and innovation. This is where ...