The conventional flip chip ball grid array (FCBGA) package platform has wide industry usage and provides high electrical performance. However, as high performance requirements increased, it encounters ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Daeduck Electronics announced the successful development of a large body FCBGA substrate for AI servers and data centers. Established in 1965, Daeduck Electronics ...

As the quantity, complexity, and functions of electronic devices in automobiles increase, understanding and characterizing package reliability is of significant concern and importance. The Automotive ...

Samsung Electro-Mechanics, the electronic parts manufacturing affiliate of Samsung Electronics, said Sunday it will ramp up the sales portion of high-end flip chip ball grid array (FCBGA) substrates ...

Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from 5G applications in ...

Samsung Electro-Mechanics announced plans to expand the proportion of high-value-added flip chip ball grid array (FCBGA) products, including servers, artificial intelligence (AI), automotive ...

Samsung Electro-Mechanics pledged to ramp up the portion of sales of its premium chip package substrate known as Flip Chip Ball Grid Array (FCBGA) to 50 percent by 2026 in order to capitalize on the ...

Tesla’s AI substrate push has reportedly drawn LG Innotek into a challenge to Samsung, putting FC-BGA packaging and ...

Samsung Electro-Mechanics has developed an automotive semiconductor package substrate tailored to driving assistance systems, in a move that extends the usable range of chip products for cars. The ...

Korean companies will show the newest semiconductor packaging technology at an annual trade show on Wednesday, as techniques grow more important in improving the performance of high-end chips. Samsung ...

Bigger . . . faster . . . stronger. It's not only an adage pushing athletes in professional sports. These same attributes are driving electronic flip chip ball grid array (FCBGA) packages (see figure ...