AI-Driven Digital and Analog Flows, Multi-Die Innovations, and Broad IP Portfolio Deliver Unmatched Performance, Power and Area Advantages Among the newest collaborations is availability of certified ...

Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect Bridge (EMIB) ...

Intel’s embedded multi-die interconnect bridge (EMIB) technology—aiming to address the growing complexity in heterogeneously integrated multi-chip and multi-chip (let) architectures—made waves at this ...

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

SUNNYVALE, Calif., April 23, 2025 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) announced today its ongoing close collaboration with TSMC to deliver robust EDA and IP solutions for TSMC's most ...