Use left and right arrow keys to seek audio. Samsung Electronics has chosen advanced semiconductor packaging and robots for its future growth engines, and will discuss the two next-gen product paths ...

Rapidus, Japan's state-backed chipmaker, has developed a prototype glass interposer for artificial intelligence chips. The company says the technology could lower production costs and strengthen its ...

Thousands of attendees gathered at ECTC to explore the latest advances in advanced packaging, AI-driven design, heterogeneous integration and thermal management. More than 2,700 attendees conversed ...

EINPresswire/ -- PrecisioNext has officially released its new-generation Fluxless TCB equipment, Loong Advance. This equipment adopts a formic acid reduction system and offers a placement accuracy of ...

Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64x400 Gbps or 32x800 Gbps pluggable optical transceiver modules. However, these high-speed modules, within their ...