AZOM

Precision Vision Systems Power Micro-LED Bonding and HBM Packaging

As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...
Electronic Design

Back-Illuminated CMOS Imagers May Increase Cell-Phone Camera Sensitivity By Two F-Stops

Flip-and-Lap in the fab moves image array to front of imager, which yields sharper, more sensitive pixels, but wafer bonding step adds cost. Tessera Technologies reports a conflict (and resolution) ...
insideHPC

CEA-Leti Reports 3-Layer Integration, Progress toward AI-Embedded CMOS Image Sensors

DENVER – May 31, 2024 – CEA-Leti scientists have reported three projects at ECTC 2024 that they say are steps to enabling CMOS image sensors (CIS) that can exploit image data to perceive a scene, ...
Semiconductor Engineering

CMOS 2.0: Layered Logic For The Post-Nanosheet Era

The semiconductor industry has relied on a simple equation for more than five decades — shrink the transistor, pack more onto every wafer, and watch performance soar as costs plummet. While each new ...