Toshiba is starting mass production of white LED packages that offer a cost-competitive alternative to current LED packaging options by eliminating the expensive sapphire substrate. Toshiba is ...

TOKYO — Sanyo Electric Co. Ltd. has moved one step ahead in system-in-package technology with its Integrated System in Board (ISB) packaging approach. Sanyo's solution takes multiple ICs, transistors ...

Aladdin introduces an updated and improved MCOB (multi chip on board) LED light source on ceramic substrate that offers higher efficiency than its predecessors and world class thermal properties as ...

[Asia Economy Reporter Suyeon Woo] As the semiconductor industry experiences a boom, supply shortages have extended to the raw material package substrates, rapidly improving the profitability of ...

Samsung Electro-Mechanics (Semco) is poised to step into the server package substrate sector with plans to build new production lines for high-end ABF substrates in South Korea and Southeast Asia to ...