TrendForce’s latest investigations reveal that the rapid expansion of AI and HPC is increasing the need for heterogeneous integration, positioning advanced packaging as a strategic priority. TSMC’s ...
LSI Logic Corp., Milpitas, Calif., today named Rick Marz as executive vice president of the newly-formed Communications and ASIC Technology Group. Marz is responsible for the strategic direction and ...
Multiple GLink-3D IPs were implemented in both dies of the SoIC-X testchip "3D packaging moves chiplet interface from die edge to the most optimal location anywhere in a chiplet, making the shortest ...
Cloud service providers are accelerating in-house ASIC development to gain tighter control over performance and costs. DIGITIMES projects that between 2025 and 2029, the compound annual growth rate ...
MILPITAS, Calif. — In a move to enable next-generation chips with up to 1 billion transistors, LSI Logic Corp. here today announced its new ASIC and system-on-chip (SoC) product portfolio, based on 90 ...
ASIC designers can obtain programmable logic's reconfigurability. Adaptive Silicon's RAM-based reprogrammable logic IP for ASICs, the MSA2500, has up to 25,000 ASIC gates for flexible designs. Typical ...
Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking ...
One of the most amazing things that human civilization has created is the silicon chip, with semiconductor technology not just about the 'CPU' or the 'GPU' anymore... but rather advanced packaging ...
Semiconductor quality control company Nova (NASDAQ:NVMI) reported Q3 CY2025 results exceeding the market’s revenue expectations, with sales up 25.5% year on year to $224.6 million. Guidance for next ...
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