Intel and CEA-Leti have optimised a hybrid direct-bonding, self-assembly process for D2W (Die-to-Wafer) bonding that has the potential to increase the alignment accuracy as well as fabrication ...
Capillary forces, arising from the surface tension of liquids, have emerged as a versatile mechanism in the microfabrication of advanced microsystems. By harnessing the thermodynamic drive of liquids ...
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