New modem provides industry-leading throughput, power efficiency, and connectivity capabilities to next-generation devices BARCELONA, Spain, Feb. 25, 2025 /PRNewswire/ -- At Mobile World Congress 2025 ...
At the heart of the agreement, DENSO and MediaTek are co‑creating automotive system‑on‑chips that will sit at the center of ...
MediaTek’s Envelope Assisted RFFE System increases power amplifier efficiency by 25%, reducing device heating rate, widening addressable bandwidth by over 100MHz in the same power envelope, and ...