In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...

System-level test (SLT), once used largely as a stopgap measure to catch issues missed by automated test equipment (ATE), has evolved into a necessary test insertion for high-performance processors, ...

Multi-die designs are gaining broader adoption in a wide variety of end applications, including high-performance computing, artificial intelligence (AI), automotive, and mobile. Despite clear ...

While multi-level signaling techniques like PAM-4 have been implemented for some time in telecom and long-haul optical applications, implementation of PAM-4 in the data center space creates a very ...