No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...

Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...

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In a significant stride towards the future of computing, Intel has unveiled one of the industry’s pioneering glass substrates for next-generation advanced packaging. This groundbreaking development, ...

Intel has provided more details about the glass substrate at its annual event while promising to deliver 1 trillion transistors in a package by 2030. At the “Intel Innovation” event in San Jose, ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...

Bottom line: Heat is a computer's worst enemy, and the latest batches of cutting-edge CPUs rolling off assembly lines are among the hottest ever produced. It's a trend that's simply not sustainable ...

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on ...