This means routing signals becomes more difficult. Thus, precise BGA (Ball Grid Array integrated circuit package) partitioning on a PCB is a crucial design aspect to minimize or eliminate crosstalk ...

Editor's note: This article addresses the need for designers of printed circuit boards for nextgen ICs to be savvy about package-on-package technology. New ways of working with sub-assembly printed ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...

A structured design review process ensures alignment across teams.

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...

Every switch-mode power supply presents a wide-band noise source. Integrating a DC/DC converter from the car board net into an automotive control unit and still fulfilling the EMC requirements of ...

Eventually, almost every EE must design a PCB, which isn’t something that’s taught in school. Yet engineers, technicians, and even novice PCB designers can create high-quality PCBs for any and every ...