Scientists at Purdue University and the University of Minnesota have solved the three-dimensional structure of the central component of a biological "motor" that powers the DNA packaging system in a ...

Humidity resistance and reliability of different packaging structures is analyzed, including the high/low temperature and temperature cycle reliability and the thermal characteristics in different ...

Mono-material flexible film packaging structures based primarily on polyethylene (PE), polypropylene (PP), or even polyethylene terephthalate (PET) are being promoted as an effective means of ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates.

The Association of Plastic Recyclers (APR), Washington, recently announced updates to its APR Design for Recyclability Recognition Program, adding new packaging components that now are eligible for ...

DS Smith and Raymarine, a manufacturer of navigation systems and electronics for the commercial marine and recreational ...