The semiconductor industry has always faced challenges caused by device scaling, architecture evolution, and process complexity and integration. These challenges are coupled with a need to provide new ...

Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often ...

Transportation agencies, including the Federal Highway Administration and several state DOTs, are pushing forward with making Building Information Modeling a bid deliverable and binding reference ...

The optimized component made of glass fiber-reinforced polyamide is represented here within the NX program with a weight-optimized lattice structure. Photo Credit, all images: Naddcon AIM3D GmbH ...

The next breakthrough to take the AI world by storm might be 3D model generators. This week, OpenAI open sourced Point-E, a machine learning system that creates a 3D object given a text prompt.

The speed of light has come to 3D printing. Northwestern University engineers have developed a new method that uses light to improve 3D printing speed and precision while also, in combination with a ...