As the advanced packaging world enters the AI era, manufacturers are exploring ways to extend the life cycle of organic substrates and successfully introduce glass substrates to high volume ...

Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to debut in early 2026.

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...