Quantum model explains how single electrons cause damage inside silicon chips

Researchers in the UC Santa Barbara Materials Department have uncovered the elusive quantum mechanism by which energetic electrons break chemical bonds inside microelectronic devices—a detrimental ...
Business Wire

OKI Develops Tiling crystal film bonding (CFB) Technology for Heterogeneous Integration of Optical Semiconductors onto 300 mm Silicon Wafers

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
C&EN

Silicon insertion methods join skeletal-editing toolbox

Skeletal-editing reactions are offering chemists an ever-expanding toolbox of techniques to add, swap, or subtract atoms in ...
C&EN

Evolved enzyme breaks silicon-carbon bond

Using directed evolution, scientists have created the first enzyme known to break a silicon-carbon bond. The finding could be a preliminary step toward biodegrading volatile methyl siloxanes—chemicals ...