EI can use its SiP technology to achieve reductions in PCB real estate up to 27x less than that of the original PCB. This is accomplished by replacing many of the packaged components with bare die and ...
IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...
Sigrity Inc this week introduced OrbitIO Planner, a tool for dynamic I/O planning across IC, package, and PCB (printed-circuit-board) design. To date, the company has offered tools for IC, package and ...
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