Semiconductor Engineering

3D Integration And Test Results From TSV-Processed Chips (CERN et al.)

A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers at CERN, IZM Fraunhofer and University of Geneva. “Particle tracking and ...
EDN

Analog in 3D ICs and through silicon vias (TSVs)

The steady march toward 3D ICs, namely mixed-signal or multi-technology systems-on-chip (SoC) or systems-in-package (SiP), is becoming a brisk jog. With a mix of military and government funding, and ...
Business Wire

OKI Achieves 3D Integration of Thin-Film Analog ICs Using CFB Technology in Collaboration with Nisshinbo Micro Devices

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...
Semiconductor Engineering

Power Delivery Challenges in 3D HI CIM Architectures for AI Accelerators (Georgia Tech)

A new technical paper titled “Co-Optimization of Power Delivery Network Design for 3D Heterogeneous Integration of RRAM-based Compute In-Memory Accelerators” was published by researchers at Georgia ...