Assessing individual components is the foremost step in system thermal analysis. A component's reported thermal-resistance data becomes the gauge for thermal evaluation and management. It is therefore ...

Rising chip and packaging complexity is causing a proportionate increase in thermal couplings, which can reduce performance, shorten the lifespan of chips, and impact overall reliability of chips and ...

In materials science, thermal testing refers to the process of subjecting materials to analysis through thermal control in order to collect data on a wide range of properties. Generally, thermal ...

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power ...

Have you ever wondered what journey a piece of equipment or machinery took before ending up in space? Or what testing was done before the rocket’s blastoff? Or why a piece of equipment failed ...

As the transistor density and switching speed of integrated circuits (ICs) increase and the package size decreases, the emerging generation of high-power ICs requires thermal management during testing ...

In a world where Application Specific Integrated Circuits (ASICs) and Application Specific Standard Products (ASSPs) are dominating every conceivable application, greater attention is being applied to ...