In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

Part one of this series, published in the January 2007 issue, discussed how to use linear superposition in the steady-state analysis of multiple heat-source systems. However, linear superposition also ...

Driven by Moore’s Law and modern, ubiquitous computation power demand, the market will continue to demand higher chip performance. Therefore, modern chips with ever-higher power densities present ...