When you purchase through links on our site, we may earn an affiliate commission. Here’s how it works. Miranda Technologies has expanded its line of Imaging Series interfacing modules with the new UVP ...
Built into a compact XMC (switched mezzanine card) conduction-cooled format, the VPP-8112 video I/O and processor module accommodates various input and output channels with high-power image processing ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
Socionext, the Fujitsu-Matsushita SoC jv, has developed a server module combining the company’s hybrid codec technology equipped with the multi-format codec, IC MB86M30 and high efficiency processor, ...
Teledyne FLIR, part of Teledyne Technologies Incorporated announced Teledyne FLIR AVP, an advanced video processor designed to power Teledyne FLIR’s Prism™ AI and computational imaging at the edge.
Modules bring dual-core ARM® Cortex™-A15 prowess to systems that demand high-performance processing, rigorous real-time time control, advanced graphics, and fanless low power DALLAS, Nov. 12, 2012- ...
Expanding the OMAP™ processor footprint in embedded applications, Texas Instruments, together with six leading system-on-module (SoM) vendors, introduced OMAP 5 processor-based modules designed to ...
For the last few years Radxa has been selling a line of computer-on-a-module systems that are pin-to-pin compatible with the Raspberry Pi CM4 and CM5. The Radxa CM3 launched in 2021 as a model with a ...
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