Taiwan has launched CoCoB, a substrate-less chip packaging platform targeting academic institutions and startups locked out ...

SK Hynix will invest 19 trillion won in a new advanced chip packaging facility in Cheongju to boost capacity for AI-driven ...

SK Hynix plans to invest nearly $13 billion in a new Cheongju packaging facility.

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

The supplier of high-bandwidth-memory products to Nvidia plans to build the chip packaging plant in Cheongju, south of Seoul ...

SK Hynix recently announced a major investment in a new South Korean plant. The Icheon-based company will spend $12.9 billion to develop a facility dedicated to advanced ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Project is being supported by $75 million federal grant and $20 million from New York state; GF will also spend $186 million on research GlobalFoundries' Fab 8 campus is seen in February 2024 in Malta ...

Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

The ongoing rise of generative AI is driving the entire semiconductor industry toward unprecedented growth. The global semiconductor market is expected to exceed $1 trillion by 2030, with a strong 8.7 ...